Heat Bed High Power MOSFET Module 25A
Heat Bed High Power MOSFET Module 25A Original price was: 225.00 EGP.Current price is: 160.00 EGP.
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Heat Bed High Power MOSFET Module 25A 12-50V

Original price was: 230.00 EGP.Current price is: 200.00 EGP.

The Heat Bed High Power MOSFET Module 25A-12V~50V is an external power expansion board designed to protect 3D printer mainboards from high electrical currents generated by heated beds

Weight0.05 kg
Dimensions6 × 5 × 2.5 cm

9 in stock

Description

Heat Bed High Power MOSFET Module 25A-12V~50V

The Heat Bed High Power MOSFET Module 25A-12V~50V is an external power expansion board designed to protect 3D printer mainboards from high electrical currents generated by heated beds

Technical Specifications
  • Max Current: 25A continuous (with proper cooling)
  • Input Voltage Range: 12V to 50V DC
  • Recommended Voltage: 12V to 24V DC
  • Control Signal: Compatible with standard 5V to 24V motherboard bed outputs (PWM/PID control)
Key Functions
  • Current Offloading: Directs heavy heating current straight from the power supply to the bed, bypassing motherboard traces.
  • Safety Protection: Prevents burnt connectors, melted plastic, and potential fire hazards caused by overworked onboard components.
  • PID Compatibility: Retains precise temperature regulation via pulse-width modulation (PWM), unlike standard mechanical relays
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