Heat Bed High Power MOSFET Module 25A

Heat Bed High Power MOSFET Module 25A

Hot bed high-power expansion module, compact appearance, unique snowflake heat sink appearance design, more powerful heat dissipation, solve the problem of excessive heat bed power and current load, this module under normal heat dissipation, measured I (Max) = 25A It can work stably for a long time, and the current should not exceed 30A during use.

This high power module is a general add-on heated bed power expansion module for 3D printer. The module can be used with any 3D printer motherboards.
With this add-on module to board lead the maximum current up to 25A.
When using heated bed 3D printer for 12V power supply which may cause excessive current during times, with this module, it can well protect the connectors on the controller board from burning.
This module is based on power MOSFET allows load current up to 25A.

Specifications:

• Item: Power MOSFET
• Input Voltage: 12~50Vdc
• Recommended Voltage: 12~24Vdc
• Max. Current: 25A
• Distance between holes: 62.8*37.8mm
• Size of suitable fan:30mm*30mm
• Size: 70*45*29mm
• Product weight: 65g
• Applicable for: Any 3D Printer Heated Bed

Package Includes:

• 1x  High High Power MOSFET Module
• 2x Power Supply Wires.

Datasheet:

• MOSFET Datasheet