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Heat Bed High Power MOSFET Module 25A
225.00 EGP Original price was: 225.00 EGP.160.00 EGPCurrent price is: 160.00 EGP.
Heat Bed High Power MOSFET Module 25A 12-50V
230.00 EGP Original price was: 230.00 EGP.200.00 EGPCurrent price is: 200.00 EGP.
The Heat Bed High Power MOSFET Module 25A-12V~50V is an external power expansion board designed to protect 3D printer mainboards from high electrical currents generated by heated beds
| Weight | 0.05 kg |
|---|---|
| Dimensions | 6 × 5 × 2.5 cm |
9 in stock
Description
Heat Bed High Power MOSFET Module 25A-12V~50V
The Heat Bed High Power MOSFET Module 25A-12V~50V is an external power expansion board designed to protect 3D printer mainboards from high electrical currents generated by heated beds
Technical Specifications
- Max Current: 25A continuous (with proper cooling)
- Input Voltage Range: 12V to 50V DC
- Recommended Voltage: 12V to 24V DC
- Control Signal: Compatible with standard 5V to 24V motherboard bed outputs (PWM/PID control)
Key Functions
- Current Offloading: Directs heavy heating current straight from the power supply to the bed, bypassing motherboard traces.
- Safety Protection: Prevents burnt connectors, melted plastic, and potential fire hazards caused by overworked onboard components.
- PID Compatibility: Retains precise temperature regulation via pulse-width modulation (PWM), unlike standard mechanical relays
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- Length: 22mm
- Width: 22mm
- Hight: 10.5mm

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